Description

A colorless, odorless, non-toxic, liquified gas. Shipped as a liquid under its own vapor pressure.

Applications

Sulfur Hexafluoride is used for plasma etching prior to chemical vapor deposition (VCD). These processes include Oxide etching, Nitride etching and wafer cleaning. Sulfur Hexafluoride gas, which is itself inert, disassociates in the presence of an RF field to form reactive fluorine ions. These highly reactive ions are excellent for etching tungsten and tungsten silicide films.

Safety Data: TLV - 1,000ppm
Click here for our printable MSDS

Specifications

Purity	99.9%	99.99%	99.999%
Nitrogen	< 225 ppm	< 40 ppm	< 5 ppm
Oxygen	< 75 ppm	< 10 ppm	< 2 ppm
CF4	< 100 ppm	< 15 ppm	< 5 ppm
HF	< 1 ppm w/w	< 0.7 ppm	< 0.5 ppm
Water	< 8 ppm	< 8 ppm	< 2 ppm

Cylinder Data
Valve	CGA 590 Brass /716 SS Diaphragm Packless
Cylinder Size		200 (44L)	150A (29L)
Contents		115 lb	70 lb
Cylinder Pressure		320 psig

Chemical & Physical Properties
Molecular Weight		146.05
Specific Volume		2.5 CF/lb

Shipping Data
DOT Label	Green, Nonflammable Gas
DOT Class	2.2
CAS No.:	2551-62-4
UN Number	1080