A colorless, odorless, non-toxic, liquified gas. Shipped as a liquid under its own vapor pressure.
Sulfur Hexafluoride is used for plasma etching prior to chemical vapor deposition (VCD). These processes include Oxide etching, Nitride etching and wafer cleaning. Sulfur Hexafluoride gas, which is itself inert, disassociates in the presence of an RF field to form reactive fluorine ions. These highly reactive ions are excellent for etching tungsten and tungsten silicide films.
Safety Data:TLV - 1,000ppm
Exceeds ASTM D2472‐00 & IEC 376 SPECS FOR ELECTRICAL INSULATING
**Moisture level guaranteed only when Electronic Fluorocarbons prepares the cylinders.
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