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Sulfur Hexafluoride

Description

A colorless, odorless, non-toxic, liquified gas. Shipped as a liquid under its own vapor pressure.

Applications

Sulfur Hexafluoride is used for plasma etching prior to chemical vapor deposition (VCD). These processes include Oxide etching, Nitride etching and wafer cleaning. Sulfur Hexafluoride gas, which is itself inert, disassociates in the presence of an RF field to form reactive fluorine ions. These highly reactive ions are excellent for etching tungsten and tungsten silicide films. 

Safety Data:TLV -  1,000ppm
Click here for our printable MSDS

 

Specifications

Exceeds ASTM D2472‐00 & IEC 376 SPECS FOR ELECTRICAL INSULATING


Grade 3.0
Purity 99.9%
Nitrogen
Oxygen
Air (N2 + O2) < 400 ppmv
CF4 < 400 ppmv
Water < 8 ppmv
Acidity (HF) < .1 ppm/w
 
Cylinder Data
Valve Choices CGA 590 Brass
  716 SS Diaphragm Packless
   
Cylinder Sizes Fill Weight (lbs)
44L/Size 200 115.0
16L/Size 80 35.0
7L/Size 35 18.0
   
Chemical & Physical Properties
Molecular Weight 146.05
Specific Volume 2.65 cu.ft/lb
Pressure @ 70 deg 23.5 psig
   
Shipping Data
DOT Name Sulfur Hexafluoride
Hazard Class 2.2
DOT No. UN 1080
DOT Label Green, Non–Flammable Gas
CAS No. 2551–62–4

**Moisture level guaranteed only when Electronic Fluorocarbons prepares the cylinders.
All concentrations are on a mol/mol basis unless otherwise stated.
Product sold on the basis of total impurities. Individual impurities may vary slightly.

 
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