Description

A colorless, odorless, non-toxic, liquified gas. Shipped as a liquid under its own vapor pressure.

Applications

Sulfur Hexafluoride is used for plasma etching prior to chemical vapor deposition (VCD). These processes include Oxide etching, Nitride etching and wafer cleaning. Sulfur Hexafluoride gas, which is itself inert, disassociates in the presence of an RF field to form reactive fluorine ions. These highly reactive ions are excellent for etching tungsten and tungsten silicide films.

Safety Data:TLV - 1,000ppm
Click here for our printable MSDS

Specifications

Exceeds ASTM D2472‐00 & IEC 376 SPECS FOR ELECTRICAL INSULATING

	Grade 3.0
Purity	99.9%
Nitrogen
Oxygen
Air (N2 + O2)	< 400 ppmv
CF4	< 400 ppmv
Water	< 8 ppmv
Acidity (HF)	< .1 ppm/w

Cylinder Data
Valve Choices	CGA 590 Brass
	716 SS Diaphragm Packless

Cylinder Sizes	Fill Weight (lbs)
44L/Size 200	115.0
16L/Size 80	35.0
7L/Size 35	18.0

Chemical & Physical Properties
Molecular Weight	146.05
Specific Volume	2.65 cu.ft/lb
Pressure @ 70 deg	23.5 psig

Shipping Data
DOT Name	Sulfur Hexafluoride
Hazard Class	2.2
DOT No.	UN 1080
DOT Label	Green, Non–Flammable Gas
CAS No.	2551–62–4

**Moisture level guaranteed only when Electronic Fluorocarbons prepares the cylinders.
All concentrations are on a mol/mol basis unless otherwise stated.
Product sold on the basis of total impurities. Individual impurities may vary slightly.